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The 14th International System-on-Chip (SoC)

Conference, Exhibit & Workshops

 October 19 & 20, 2016

University of California, Irvine (UCI) - Calit2

13th International SoC Conference In Pictures. . .


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Welcome to the SoC Exhibit & Reception!


3rd International System-on-Chip (SoC) Conference - November 1 & 2, 2005


Exhibit Date & Time:  Tuesday, November 1, from 4:30 pm - 8:30 pm.

Register for Online Complimentary Exhibit Pass

Network with Technologists from Leading-Edge Companies, See innovative Technology & Product Demonstrations, Door Prizes, Complimentary Light Hors D'oeuvres, IEEE-OC Student Design Contest, and Much More. . . 

Radisson Hotel Newport Beach (Free Parking)



Visiting the SoC Conference Exhibit is FREE with advance online registration.

Walk-in Registration $25.00



Click on this link to Register for a FREE Exhibit Pass


Selected Demos. . . .

Taylor & Francis
CRC Press



Taylor & Francis/CRC Press is a leading publisher of technical and scientific books, journals, and electronic databases for engineers and scientists. We feature a wealth of titles on digital chip and wireless design and applications. Recent works include The Embedded Systems Handbook, Low-Power Processors and Systems on Chips, and Electronic Design Automation for Integrated Circuits Handbook.

All SoC attendees receive 15% off a single title, 20% off any two titles, and 25% off three or more titles!

For more information about these and other cutting-edge CRC titles, visit www.crcpress.com or stop by our table.

eASIC Corporations


Enabling low-cost and ease-of-design using single via programmable Structured ASIC:

eASIC introduces a novel Structured ASIC architecture, which merges proven programmable logic fabric with single-via customizable segmented routing. This Structured ASIC allows for NRE-free and fast-turn designs of any volume, providing ASIC performance, and re-programmability for post-fabrication debug. The demo presents a case study of the implementation of SoC Processor reference design.


K-Micro is the leader in advanced yet affordable ASIC technology. Our advanced process technologies include support for 90nm at TSMC. We have an extensive portfolio of system-level IP, including IEEE 802.11a-j, a full suite of ARM & MIPS cores, Ceva & StarCore DSPs, H.264, MPEG-4, USB 2.0, Serial ATA, PCI-Express, and K-Micro’s patented Image Processor technology. Visit the K-Micro booth at the 3rd International SoC Conference to learn more about K-Micro’s advanced technologies, including our new, revolutionary Topaz computing sub-system for SoCs, featuring the MIPS32® 24Kf™.


Denali is the leading provider of EDA tools and IP solutions for chip interface design, integration and verification. Denali will be highlighting Its Databahn™ and Dataplex™ IP controller products, which provide optimal performance from external Flash, DRAM, and hard disk drives devices. Denali will also present its latest product, Blueprint, an ESL product for on-chip register design and management, and its its PureSpec™ and MMAV™ products - the industry most trusted verification IP for critical chip interfaces such as: DRAM, Flash, PCI Express, ASI, AMBA, USB, Ethernet, CE-ATA, and Serial ATA.


Tensilica is addressing the growing need for optimized, application-specific microprocessor solutions in high-volume embedded applications. With a configurable and extensible microprocessor core called Xtensa, Tensilica is the only company that has automated and patented the time-consuming process of generating a customized microprocessor core along with a complete software development tool environment, producing new configurations in a matter of hours.

Micron Technologies


Micron Technology, Inc., is one of the most efficient and innovative semiconductor companies in the world, manufacturing and marketing a broad line of DRAM components and modules, NAND Flash memory, CMOS image sensors, and other semiconductors. All products are offered in multiple generations, densities, configurations, and packages for a wide range of applications.

Micron will demonstrate its Flash Translation Layer (FTL) software running on an industry-standard processor platform. The demonstration will highlight several robust features that differentiate this software product, such as automatic wear leveling and power failure protection.

Giga Scale IC


InCyte - Determine your next chip's die size, power, leakage, and cost

Come visit Giga Scale IC and learn more about the InCyte chip estimation tool, capable of estimating chip die size, power, leakage, yield, and cost to within 5-10% of silicon. InCyte enables design teams to explore a design across multiple technology nodes, process variants, and IP libraries to determine which set of implementation options will meet your design goals.

Aplus Flash Technology, Inc.


Aplus Flash Technology is a fabless IC company offering non-volatile memory IP and memory products. Its line of NVM IP includes ROM, OTP, NTP, EEPROM, FLASH+EEPROM and FLASH, and can be embedded into a variety of communications, computing and consumer applications. Aplus offers both standard IP blocks as well as customized ASIC designs. In addition to its IP Aplus also develops standard memory products. Its IP blocks can be found in applications from smart cards to talking toys to microcontrollers and other IC drivers. Aplus' embedded licensees including leading global semiconductor companies and its foundry connections span worldwide in countries including Taiwan, Korea and China.



See a demonstration of Cadence® Encounter® RTL Compiler global synthesis. As a key component of the Cadence Encounter digital IC design platform, Encounter RTL Compiler delivers global synthesis for smaller, faster, and low-power chips in less time.


Nascentric invites you to see Nascim, a new generation of Fast-SPICE simulator. Nascim is the first in a series of advanced simulation and analysis products being developed by Nascentric. Initially focused on digital logic and memories, Nascim is 10X faster than any other Fast-SPICE simulator available and exceeds the accuracy and capacity requirements set for leading-edge process technologies. Even your largest SOC designs can be simulated with unprecedented speed and accuracy in Nascim.


Synplicity is a leading supplier of innovative synthesis, verification, and physical implementation software solutions that enable the rapid and effective design and verification of semiconductors.



Magma will be demonstrating their latest EDA Tools for 90nm, 65nm, etc., designs at the 3rd SoC Conference.



Synfora, Inc. of Mountain View, Calif., is the leading provider of application engine synthesis (AES) software used to design complex systems-on-chips (SoCs). Synfora’s technology helps to reduce fixed design costs and dramatically speed chip development and time-to-market. Synfora targets companies in the audio, video, imaging, wireless, and security segments of the IC design market.

Chartered Semiconductor


Chartered Semiconductor will be sharing information regarding their latest Foundry-related technologies and services with the 3rd International SoC Conference & Exhibit attendees.


Sequence is focused on Power Management and Power Grid Integrity solutions for SoC designs. As part of Power Management, Sequence offers a power analysis and reduction solution from RTL to signoff. As part of Power Grid Integrity, Sequence offers a dynamic voltage drop analysis and optimization solution. It has also recently launched a unique formal power grid verification solution for detecting errors which other traditional approaches are unable to detect. Sequence’s unique solutions enable SoC designers to concurrently analyze and optimize for leakage power, dynamic power and dynamic voltage drop, thereby, reducing time to market, design risk and chip costs for power-aware applications.

GDA Technologies, Inc.

GDA Technologies Inc. is a leading Electronic Design Services (EDS) and Silicon Intellectual Property (SIP) solution provider for the embedded, networking, & consumer electronics markets. GDA specializes in designing ASICs, FPGAs, SoCs, IP cores, boards, embedded software, & complete systems from concept to product. GDA has successfully developed products in the areas of enterprise server, ATCA, desktop, & embedded computing, digital audio & video applications, Internet appliances, voice and data networking applications. GDA is a leading solutions provider for fast-interconnect technologies such as PCI Express, HyperTransport, RapidIO, Ethernet and Advanced Switching. GDA is headquartered in San Jose, CA with satellite design centers in Boston, Sacramento, Chennai, Kochi, and Bangalore, India.

HARDI Electronics



HARDI Electronics, Inc. will be demonstrating their latest EDA tools in the 3rd SoC Conference & Exhibit.  The HAPS-34 helps both ASIC and ASSP designers to verify their designs quickly and accurately by leveraging the best-in-class I/O connectivity and best-in-class flexibility of the HARDI ASIC Prototyping System (HAPS) family of motherboards and daughter boards.  Each HAPS motherboard based on the largest Xilinx Virtex-4 FPGAs, can handle designs from 3-6 million ASIC gates. The boards can be stacked like Legos™ to increase capacity to any size ASIC. No other system on the market today has that level of flexibility.

Novas Software


Novas Software is the leading provider of robust, tool-independent design debug systems to companies designing complex ICs, embedded processing platforms, and SoCs throughout the range of systems to silicon methodologies. Novas’ solutions provide engineers with greater degrees of design comprehension, process automation, and methodology unification.


CEVA will demonstrate H.264 running on CEVA-X1620 Silicon, VGA resolution 12 fps and QVGA 30 fps. CEVA will also demonstrate MPEG4 running on the CEVA-X1620 at only 25MHz, CIF resolution 25fps.

Handshake Solutions

By using its experience, gained on dozens of design projects and close co-operation with customers, Handshake Solutions has developed a complete product suite based on Handshake Technology, a proven methodology for clock-less circuit design. Handshake Solutions offers design tools, design services and Handshake Technology based IP blocks (8051 subsystem,
ARM9 processor) enabling the creation of ultra low power, low-EME SOCs and facilitating easy integration of RF/Analog and digital components. Useful for any embedded system, Handshake Solutions' products are particularly suited for Automotive, Smart Card and Wireless applications and for Medical Implants.

RapidIO Trade Association


The RapidIO Trade Association and its global members drive the RapidIO interconnect architecture. This ISO-certified, open-standard seamlessly enables the chip-to-chip, board-to-board, control, backplane and data plane interconnections needed in high-performance networking, communications and embedded systems. RapidIO-based products are shipping now, including silicon chips, boards and systems. Detailed information on the RapidIO
specification, products, design tools, member companies, and membership is available at www.RapidIO.org.

California State University, Fullerton

California State University, Fullerton is a high-quality, comprehensive four-year public university that offers superior teaching and prepares students to be leaders in business and industry, science, education, community service, the arts, politics, and many other fields. Part of a 23-campus California State University System that views learning as a powerful force for growth and change, Cal State Fullerton offers over 100 degree programs (graduate and undergraduate) in eight colleges, as well as a number of certificate programs. The university is located in a region known for its economic vitality, cultural diversity, multitude of leisure activities and attractions, and ideal climate.   The College of Engineering and Computer Science at Cal State Fullerton offers bachelor's and master's degrees in Civil Engineering, Computer Science, Electrical Engineering, and Mechanical Engineering, as well as a bachelor's degree in Computer Engineering and an online master's degree in Software Engineering.

Chapman University


Chapman University will be sharing information regarding its Computer Science and Embedded Engineering Program with the SoC Conference and Exhibit attendees.


Orange County Chapter


IEEE will be sharing information regarding its services and benefits with the SoC Conference and Exhibit participants.

IEEE will be also distributing Micro magazine, Computer magazine, etc., during the conference and at the IEEE exhibition table. 

American Electronic Association

AeA Orange County Council

AeA will be sharing information regarding its services and benefits with the SoC Conference and Exhibit participants.

AeA is the largest association of technology companies in the United States with nearly 3,000 member companies and 1.8 million employees. The AeA network connects member companies to investors at world-class financial conferences for public and private companies, maintains a unique public policy presence in Washington and Sacramento for members concerned with government actions at the state and federal levels and offers valuable business and insurance services that add value to our members' top and bottom line

Visit THE SoC Exhibits!

  • Meet one-on-one with SoC experts representing a wide variety of companies.
  • Ask leading-edge companies your toughest questions!
  • Discuss development tools and design challenges with SoC experts.
  • Connect with companies offering practical solutions to your design challenges.
  • "Seeing Is Believing!" See demos of EDA tools from leading-edge EDA vendors.
  • And much more!



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