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8th International System-on-Chip
(SoC)
Conference, Exhibit & Workshops
November 3 & 4, 2010
Hilton Irvine/Orange
County Airport, Southern California
TableTop Exhibit
Register for Free Exhibit Pass!
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The 8th International SoC Conference Information will be available August
2010.
If your organization is interested in participating in this highly
informative and recognized Conference, please contact us via the following
emails or phone numbers:
SoC@SavantCompany.com or
SoC@SoCconference.com
949-851-1714 or
949-955-3327
We look forward to working with you!
The SoC Conference Organizing Committee
&
The SoC Conference Technical Advisory Board
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Visiting the SoC Conference
Exhibit is FREE with advance online registration.
Click on this link to
Register for a FREE Exhibit Pass
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Selected Participating Companies & Organizations . . .
Selected Demo
Descriptions. . . .
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IC Manage
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IC Manage Global Design
Platform. IC Manage Global Design Platform (ICM GDP) is a next-generation
design data management system that efficiently manages, locates and
assembles components and delivers reuse across the enterprise. It is the
first hardware/firmware/software design data management solution to offer a
multidiscipline design assembly, derivative management, real-time worldwide
design content delivery, and now enterprise-wide and secure multi-company
collaborative design project management environment. |
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MoSys, Inc.

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MoSys, Inc. (NASDAQ: MOSY) is
a leading provider of serial chip-to-chip communications solutions that
deliver unparalleled bandwidth performance for next generation networking
systems and advanced system-on-chip (SoC) designs. MoSys' Bandwidth
Engine(TM) family of ICs combines the company's patented 1T-SRAM(R)
high-density memory technology with its high-speed 10 Gigabits per second (Gbps)
SerDes interface (I/O) technology. A key element of Bandwidth Engine
technology is the GigaChip(TM) Interface, an open, CEI-11 compatible
interface developed to enable highly efficient serial chip-to-chip
communications. MoSys' IP portfolio includes SerDes IP and DDR3 PHYs that
support data rates from 1 - 11 Gbps across a variety of standards. In
addition, MoSys offers its flagship, patented 1T-SRAM and 1T-Flash(R) memory
cores, which provide a combination of high-density, low power consumption,
high-speed and low cost advantages for high-performance networking,
computing, storage and consumer, graphics applications. MoSys IP is
production-proven and has shipped in more than 325 million devices. MoSys is
headquartered in Sunnyvale, California. More information is available on
MoSys' website at http://www.mosys.com. MoSys, 1T-SRAM and 1T-Flash are
registered trademarks of MoSys, Inc. The MoSys logo and Bandwidth Engine are
trademarks of MoSys, Inc. All other marks mentioned herein are the
intellectual property of their respective owners. |
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Mindspeed Technologies

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Mindspeed
Technologies, Inc. designs, develops and sells semiconductor solutions for
communications applications in the wireline and wireless network
infrastructure, which includes today's separate but interrelated and
converging enterprise, broadband access, metropolitan and wide area
networks. Our products are classified into three focused product families:
communications convergence processing, high-performance analog and wide area
networking communications. Our products are sold to original equipment
manufacturers (OEMs) for use in a variety of network infrastructure
equipment, including voice and media gateways, high-speed routers, switches,
access multiplexers, cross-connect systems, add-drop multiplexers, digital
loop carrier equipment, IP private branch exchanges (PBXs), optical modules,
broadcast video systems and wireless base station equipment.
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Total Phase
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Total
Phase manufactures user-friendly, powerful, and affordable USB, I2C, SPI,
and CAN development tools for embedded systems engineers. Total Phase tools
combine best-of-breed features such as Windows, Linux, and Mac OS X support,
a royalty-free API, free software updates, and free lifetime support. Please
visit us at http://www.totalphase.com. |
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University of California, Irvine.
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UC Irvine
TBD. . .
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Moobila
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Moobila is
an iPhone application development company that focuses on creating custom
iPhone applications for individuals, businesses or groups looking to provide
customers with iPhone applications developed to their specifications but who
lack the technical expertise to develop such applications. Moobila is a
member of the iPhone developer program and provides services to develop both
native and web applications for the iPhone. Developers at Moobila have a
strong track record in converting web applications onto the mobile format,
especially into the iPhone format. In addition Moobila developers have
experience in developing and optimizing multimedia and computation intensive
applications for embedded and mobile platforms while integrating its design
with other web services platforms such as Google’s API’s. Moobila developers
work with Xcode/iPhone SDK , PHP, MySQL, Ruby on Rails, and Cocoa Framework,
and objective C. Moobila offers a full turnkey solution through its
marketing division. We create videos that demonstrate our customers
application used in the ‘real world’ along with a video that acts as a
tutorial. These videos come packaged with a press release designed to
articulate and introduce your application into the market. Promo codes are
generated and sent out with letters of introduction to the most widely
viewed iPhone application reviewers. Whether you are looking to setup a team
to build applications for your company, or you are looking for someone to
help you market your applications in the U.S., then Moobila is here to help. |
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Toshiba
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Combining
quality and flexibility with design engineering expertise, TAEC brings a
breadth of advanced, next-generation technologies to its customers. This
broad offering includes memory and flash memory-based storage solutions, a
broad range of discrete devices, displays, medical tubes, ASICs, custom SOCs,
microprocessors, microcontrollers and wireless components for the computing,
wireless, networking, automotive and digital consumer markets. TAEC is
an independent operating company owned by Toshiba America, Inc., a
subsidiary of Toshiba Corp. (Toshiba), Japan's largest semiconductor
manufacturer and the world's fourth largest semiconductor manufacturer. In
more than 130 years of operation, Toshiba has recorded numerous firsts and
made many valuable contributions to technology and society. |
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Target

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Target (www.retarget.com) is
the leading provider of EDA tools for the design, programming, and
verification of application specific processor cores (ASIPs). ASIPs provide
an alternative to the two most common implementation choices (software
running on general purpose embedded processors or algorithms implemented as
fixed function RTL). With ASIPs, IP
designers can create designs that perfectly match design requirements for
both efficiency and flexibility. Target's IP Designer tool-suite includes
unique, patented, retargetable
C-compiler technology that produces code of comparable efficiency to
hand-optimized assembly code. Also included is automated RTL generation
especially tuned to low-power requirements. Fast instruction-set simulation,
insightful debug tools, and comprehensive verification tools round out the
offering. IP Designer has been applied by customers worldwide for
diverse application domains, including GSM, WCDMA and HSDPA handsets, VoIP,
audio coding, automotive infotainment, ADSL and VDSL modems, wireless LAN,
hearing
instruments, mobile image processing, video processing, and various control
and interfacing applications. Target is a spin-off of IMEC, is headquartered
in Leuven, Belgium, with North American operations in Boulder, Colorado.
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PalmChip

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The AcurX SoC Platform
integrates common processor cores, popular peripherals, and proprietary
intellectual property to provide optimized solutions, such as this
Demonstration which runs a Linux Network Server, communicates with a
personal computer, and plays movies.
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NoiseCoupling.com
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NoiseCoupling.com is a
privately held company focusing on research of noise coupling in integrated
circuits and Systems-on-Chip, development of noise coupling models and
simulation techniques, and noise coupling education through publications,
technical seminars, and hands-on workshops. NoiseCoupling.com’s mission is
to build the technical skills needed to understand the noise coupling
mechanisms in various fabrication technologies and including the parasitic
effects of packages, interconnects, and printed circuit boards, to implement
efficient suppression techniques that match the noise coupling mechanisms in
each specific application, and to perform accurate simulations that cover
all the dominant noise coupling mechanisms existent in a particular design.
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Chip Design Magazine

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Extension
Media is a publisher of over 20 business-to-business magazines, resource
catalogs, newsletters and web sites that address high-technology industry
platforms and emerging technologies such as chip design, embedded systems,
software and infrastructure, intellectual property, architectures, operating
systems and industry standards. Extension Media publications serve several
markets including Electronics, Software/IT and Mobile/Wireless.
Extension Media information products provide engineers, embedded developers,
software developers, IT professionals and design professionals with in-depth
product, technology and solutions oriented information. |
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HCD
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Packaging
and Component Specialists, Inc. was founded in September 1991 as a
manufacturer's representative firm specializing in representing principals
whose products are used in the electronic packaging areas. Various
lines have been added through the years and we now offer a complete line of
products from key manufacturers, all of whom are leaders in their fields.
PCS actively covers the area of Southern California from Santa Barbara in
the north to the Mexican border, and from the Pacific Ocean to the Arizona
and Nevada state lines. We also cover the Las Vegas area of Nevada. Headquartered in Sunnyvale, California, High Connection Density, Inc. (HCD)
is a premier source of high frequency and high current, form factor
optimized solutions through advanced electronic packaging and connection
technologies. HCD offers high performance solutions for a variety of
markets, including the server, communications, semiconductor test, medical,
and automotive markets. Working closely with our engineers customers can
take advantage of flexible, easily modifiable connector and module options
for applications requiring high frequency, high current, and small form
factor electronics. HCD's manufacturing facilities in Sunnyvale and Taiwan
are complemented by several second source relationships. |
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California State University, Fullerton
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California
State University, Fullerton is a high-quality, comprehensive four-year
public university that offers superior teaching and prepares students to be
leaders in business and industry, science, education, community service, the
arts, politics, and many other fields. Part of a 23-campus California State
University System that views learning as a powerful force for growth and
change, Cal State Fullerton offers over 100 degree programs (graduate and
undergraduate) in eight colleges, as well as a number of certificate
programs. The university is located in a region known for its economic
vitality, cultural diversity, multitude of leisure activities and
attractions, and ideal climate.
The College of Engineering and Computer Science at Cal State Fullerton
offers bachelor's and master's degrees in Civil Engineering, Computer
Science, Electrical Engineering, and Mechanical Engineering, as well as a
bachelor's degree in Computer Engineering and an online master's degree in
Software Engineering. |
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Montage, Inc.
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TBD . . .
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IEEE-OC Section
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TBD . . .
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Chapman University

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Chapman University will be sharing
information regarding its Computer Science and Embedded Engineering Program
with the SoC Conference and Exhibit attendees.
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Copyright © 2003-2010 by
Savant Company Inc. All Worldwide Rights Reserved.
Wafer images courtesy of Intel Corporation, Micron Technologies & Altera Corporation.
Copyright © 2003-2010 by Savant Company Inc. All
Worldwide Rights Reserved.
Wafer images courtesy of Intel Corporation, Micron Technologies & Altera
Corporation.
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