CALL FOR SPONSORS, CONTRIBUTIONS, SPEAKERS, EXHIBITORS & WORKSHOP COORDINATORS

98% of attendees at Savant's past International SoC Conferences and Exhibits said

they would recommend our SoC Conference to someone else!  Please See Client Testimonials.

Pictures of . . .  The 7th International System-on-Chip (SoC) Conference, Exhibit & Workshops . . .

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SoC Conference Technical Scope

Multimillion-transistor System-on-Chip (SoC) devices, comprising several CPUs & DSPs, analog, optical, digital, and Micro-Electro-Mechanical Systems (MEMS), are integral parts of everyday communication, entertainment, medical, digital consumer, automotive, and military products.

Over the past 7 years, the International SoC Conference has established itself as the premier annual event for System-on-Chip and VLSI. The Conference provides an outstanding platform for sharing and disseminating groundbreaking research, revolutionary product announcements, and innovative technical tutorials, and it has established itself as the forum for debating emerging challenges in System-on-Chip, VLSI, and Nanotechnologies.

The 8th International SoC Conference, Exhibit & Workshops will be held at the Irvine Hilton (Irvine, California) and will offer two days of technical presentations, panel discussions, tabletop exhibits, tutorials, and a variety of technical workshops.
 

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SoC Conference Sponsorship opportunities

The SoC Conference provides a series of unique sponsorship opportunities for participating companies interested in promoting their names, logos, and brands and their products and technologies to a very targeted and interested audience

To receive a complete listing of all available sponsorship opportunities, please contact SoC@SoCconference.com or call us at 949-851-1714. We will be more than happy to customize our sponsorship packages to meet your budget and your marketing objectives.

SoC Conference Platinum and Gold sponsors’ logos will be displayed on the SoC Conference main page as well as on the Savant Company Web page until two weeks after the Conference. Sponsors’ logos are always displayed on the SoC Conference public archives page. Our Platinum and Gold sponsorship packages include Tabletop Exhibit opportunities, several complimentary Conference passes, and a variety of promotional opportunities. For specific sponsorship details, please contact SoC@SoCconference.com 
 

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SoC Conference Tabletop Exhibit

The SoC Conference Tabletop Exhibit is an outstanding, inexpensive forum for your Sales, Marketing, and Applications Engineering teams, allowing them to meet face-to-face with design engineers attending the Conference or visiting the Tabletop Exhibit.

To reserve your Tabletop Exhibit space please contact SoC@SoCconference.com.  SoC Conference Tabletop Exhibit provides several free full conference passes as well as a series of outstanding promotional opportunities for the exhibiting companies. Please contact us for more information and to receive the Tabletop Exhibit application/contract.

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SoC Conference Speaking opportunities

Track and Session Presenters, Keynote Speakers, and Panel Members who can contribute their professional expertise have a wonderful opportunity to share their innovative SoC, ASIC, ASSP, FPGA, and Foundry-related technology or products at this event to a very focused and targeted audience.

Technical presentations are invited that address new and previously unpublished results on System-on-Chip topics and related areas such as CAD/EDA Tools, Analog, Mixed-Signal and RF Circuits and Systems, NoC, etc.
 

To explore speaking opportunities at the 8th International SoC Conference, for information on our Tabletop Exhibit, or to develop highly targeted Workshops, please contact the SoC Conference Organizing Committee at:

SoC@SavantCompany.com     or    SoC@SoCconference.com   or    (949) 851-1714

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AUTHOR INFORMATION AND FORMAT

Presentations at the International System-on-Chip (SoC) Conference are in the form of 30-minute talks with PowerPoint slides. Presentation slides will be published in the SoC Conference Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in the SoC Conference Proceedings.

Submissions must include a title, an extended abstract (two pages maximum), and the presenter's contact information (name, affiliation, job title, bio, address, phone, fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential.

Submissions are evaluated by the SoC Conference Organizing Committee and the SoC Technical Advisory Board on the basis of the overall complexity of the technology or device, the degree of innovation, the incorporation of advanced technology, the potential market significance, and most importantly, the anticipated interest to the audience. Research and software proposals will be evaluated by similar criteria. If you are describing a product, you must indicate its status: its design, development, tape out, silicon, shipping, etc.

Please submit your extended abstract in plain ASCII or PDF by April 15, 2010, to: SoC@SoCconference.com   or   SoC@SavantCompany.com

Submissions containing figures may be submitted in .pdf, but plain ASCII text or MS Word is preferred. Authors will be notified of acceptance by June 15, 2010. Please check the SoC Conference website for all conference-related updates and changes.

Deadline for Abstract & Bio Submissions: April 15, 2010 (the Tax day!)

Notification of Acceptance: June 15, 2010

Conference Agenda Available: August 2010
 

Please send questions to:  SoC@SoCconference.com   or   SoC@SavantCompany.com    
 

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Selected Areas of Interest

Low-Power Design Techniques
General Purpose Processor and System Interface Chips
Multi-Core, Multi-Processor Technologies
Interconnect technologies
Nano-Structures
Micro-Arrays,
On-chip optics
Low-power chips
Dynamic Power Management
Wireless LAN/Wireless WAN
FPGAs and FPGA Based Systems
Display Technology
Application-Specific / Embedded Processors
Mobile Phone
Digital Signal Processing
Network/Security
Graphics/Multimedia/Game
Advanced Packaging Technology
Reliability and Design for Test
CMOS, Scaling, and the Future
Interconnect-Centric SoC Design
Network-on-Chip (NoC)
Imaging System- on-Chip (I-SoC) -- CMOS Image Sensors & Image Processing
Video Compression IPs for H.264, MPEG-4, VC-1, Wavelets, JPEG2000
Video-related IPs such as DVB-H, DMB, ISDB-T, DVB-T, HDTV, etc.
Wireless IPs for GPRS, HSPDA, 3.5G, 4G, 802.11n, 802.15.3a (UWB), 802.16 (WiMax), SDR (Software Defined Radio), etc.
ASIC/SoC/Foundry for 40nm and Sub-40nm
SoC Design Challenges
Is Structured ASIC Dead?
FPGA Technology Beyond 40nm
High-speed IOs (SerDes, etc.) Design Challenges
1394, USB, and other high-speed IO IPs
Modeling Techniques for SoC/ASIC Designs
Configurable CPUs and DSPs for SoC Platform Design
SIP vs. SoC vs. 3D Packaging
SoC Design Using Programmable ICs & Structured ASICs
System-on-Chip Platform Design
Distributed processing on One Die
EDA Tools for 23nm and Post-23nm
Memory Subsystem Design
Memory on-chip vs. off-chip
New Memory Technologies
New Ideas in Placement and Floorplanning
New Opportunities in High-level Synthesis
ASIC/SoC Design Methodologies
IP Design, Modeling, and Reuse
SoC Testing and Verification
... and other topics
 

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International System-on-Chip (SoC) Conference Technical Advisory Board

Attendee demographics for past SoC Conferences (based on job responsibilities):

• 76% SoC & ASIC Designers, Design Engineers, and Engineering Management

• 11% Technical Marketing, Sales, or Business Development Management

• 8% University Engineering Professors and Engineering Students

• 3% Strategic Planning, Media, Analysts

• 2% Other

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