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SoC
Conference
Technical
Scope
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Multimillion-transistor System-on-Chip
(SoC) devices, comprising several CPUs & DSPs, analog, optical, digital,
and Micro-Electro-Mechanical Systems (MEMS), are integral parts of
everyday communication, entertainment, medical, digital consumer,
automotive, and military products.
Over the past 9 years, the International SoC Conference has established
itself as the premier annual event for System-on-Chip and VLSI. The Conference provides an outstanding platform for sharing and
disseminating groundbreaking research, revolutionary product
announcements, and innovative technical tutorials, and it has
established itself as the forum for debating emerging challenges in
System-on-Chip, VLSI, and Nanotechnologies.
The 10th International SoC Conference, Exhibit & Workshops will be held
at the Hilton Irvine (California) and will offer two days of
technical presentations, panel discussions, tabletop exhibits,
tutorials, and a variety of technical workshops. |
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For the International System-on-Chip (SoC)
Conference, the premier event devoted to Chip Design and Development,
the SoC Conference Organizing Committee is seeking submissions on all
aspects of IC & IP designs including: |
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Semiconductor
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Foundry Services
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RF & Analog/Mixed-Signal
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Novel CMOS Design Techniques
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EDA Tools, Algorithms, and Tool Usage
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Design Methodologies, Techniques, and Technologies for All Aspects of
Electronic Circuits
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Network-on-Chip (NoC) & System-Level Communication
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FPGA Design, Tools, and Applications
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Embedded Design and Platforms
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Floor-Planning
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Logic Synthesis and Circuit Optimization
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Timing and Circuit Analysis and Circuit Optimization
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Emerging Specialized Design Technologies
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Manufacturing Test and Silicon Debug
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Beyond Die-Integration and
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Package/Hybrid/Board Design
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Novel Software Architecture for Multicore SoCs
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IC & IP Design
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SiP and Innovative Packing Techniques
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Circuit Simulation and Interconnect Analysis
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Timing Analysis and Design for Manufacturability
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Physical Design and Manufacturability
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Power Analysis and Low-Power Design
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Validation, Test Planning, Testing and Coverage
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Formal Verification
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Signal Integrity and Design Reliability
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System-Level Design and Co-Design
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High-Level Synthesis
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Physical Synthesis Tools and Techniques
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Low-Power SoC Platforms
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Cost-Effective SoC-Based Platform Solutions
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Designing Multicore SoC Platforms
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Embedded Software, Tools and Design
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In addition to conventional SoC-related topics, the SoC Conference
invites proposals for topics for individual Tracks, Panels, Workshops
and Tutorials.
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SoC
Conference
Sponsorship
opportunities
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The SoC Conference provides a series of
unique sponsorship opportunities for participating companies interested
in promoting their names, logos, and brands and their products and
technologies to a very targeted and interested audience
To receive a complete listing of all available sponsorship
opportunities, please contact SoC@SoCconference.com or call us at
949-851-1714. We will be more than happy to customize our sponsorship
packages to meet your budget and your marketing objectives.
SoC Conference Platinum and Gold sponsors’ logos will be displayed on
the SoC Conference main page as well as on the Savant Company Web page
until two weeks after the Conference. Sponsors’ logos are always
displayed on the SoC Conference public archives page. Our Platinum and
Gold sponsorship packages include Tabletop Exhibit opportunities,
several complimentary Conference passes, and a variety of promotional
opportunities. For specific sponsorship details, please contact SoC@SoCconference.com
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SoC
Conference
Tabletop
Exhibit
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The SoC Conference Tabletop Exhibit is an
outstanding, inexpensive forum for your Sales, Marketing, and
Applications Engineering teams, allowing them to meet face-to-face with
design engineers attending the Conference or visiting the Tabletop
Exhibit.
To reserve your Tabletop Exhibit space
please contact SoC@SoCconference.com. SoC Conference Tabletop
Exhibit provides several free full conference passes as well as a series
of outstanding promotional opportunities for the exhibiting companies.
Please contact us for more information and to receive the Tabletop
Exhibit application/contract.
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SoC
Conference
Speaking
opportunities
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Track and Session Presenters, Keynote Speakers, and Panel Members who
can contribute their professional expertise have a wonderful opportunity
to share their innovative SoC, ASIC, ASSP, FPGA, and Foundry-related
technology or products at this event to a very focused and targeted
audience.
Technical presentations are invited that address new and previously
unpublished results on System-on-Chip topics and related areas such as
CAD/EDA Tools, Analog, Mixed-Signal and RF Circuits and Systems, NoC,
etc.
To explore speaking opportunities at the
9th International SoC Conference, for information on our Tabletop
Exhibit, or to develop highly targeted Workshops, please contact the SoC
Conference Organizing Committee at:
SoC@SavantCompany.com
or SoC@SoCconference.com or
(949) 851-1714
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AUTHOR
INFORMATION
AND
FORMAT
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Presentations at the International System-on-Chip (SoC) Conference are
in the form of 30-minute talks with PowerPoint slides. Presentation
slides will be published in the SoC Conference Proceedings. Participants
are not required to submit written papers, but a select group will be
invited to submit a paper for inclusion in the SoC Conference
Proceedings.
Submissions must include a title, an extended abstract (two pages
maximum), and the presenter's contact information (name, affiliation,
job title, bio, address, phone, fax, and email). Please indicate whether
you have submitted, intend to submit, or have already presented or
published a similar or overlapping submission to another conference or
journal. Also indicate if you would like the submission to be held
confidential.
Submissions are evaluated by the SoC Conference Organizing Committee and
the SoC Technical Advisory Board on the basis of the overall complexity
of the technology or device, the degree of innovation, the incorporation
of advanced technology, the potential market significance, and most
importantly, the anticipated interest to the audience. Research and
software proposals will be evaluated by similar criteria. If you are
describing a product, you must indicate its status: its design,
development, tape out, silicon, shipping, etc.
Please submit your extended abstract in plain ASCII or PDF to: SoC@SoCconference.com or
SoC@SavantCompany.com ASAP.
Submissions containing figures may be submitted in .pdf, but plain ASCII
text or MS Word is preferred.
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Don't
Miss Out! |
Please submit your proposed Abstract & Bio ASAP
for SoC Conference Organizing Committee & Technical Advisory Board
Review and Consideration.
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Questions |
SoC@SoCconference.com or
949-851-1714 |
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Attendee
demographics |
Attendee demographics
for past SoC Conferences (based on job responsibilities):
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76% SoC & ASIC Designers, Design Engineers, and
Engineering Management
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11% Technical Marketing,
Sales, or Business Development Management
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8% University Engineering
Professors and Engineering Students
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3% Strategic Planning,
Media, Analysts
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2% Other
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November 2011
The 9th International
System-on-Chip (SoC) Conference
Participants |
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Keynote Speakers
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Purdue University
Dr. Eugenio Culurciello,
Associate Professor,
Electrical Engineering. |
Xilinx
Dr.
Steve Trimberger, Fellow, Circuits & Architectures Group. |
Microsemi
Paul
Pickle, Senior Vice President, Integrated Circuit Group. |
Johns Hopkins University
Dr. Ralph Etienne-Cummings,
Professor Department of Electrical and Computer Engineering. |
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Platinum Sponsors
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Gold Sponsors
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Selected Participating Companies, Universities & Organizations
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SoC Conference Tracks & Panels
30-min Technical Presentation Opportunities In the Following Tracks:
1.
Emerging Technologies, Trends, and Possibilities in Designing Multicore
SoC Platforms.
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Analog and Mixed-Signal Design Trends and Challenges for Low-Power Embedded
SoC Platforms.
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SOI vs. CMOS for Analog & Digital Circuits – Technology, Trends, Challenges,
and Emerging Applications.
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Green Chips: Technologies, Tools, and Methodologies in Designing Ultra
Low-Power Multicore SoCs.
Panelist
Opportunities (No Abstract or Presentation Is Required –Please Submit Full
Title, Bio and Picture for TAB Review and Consideration) In the Following
Panels:
1.
Emerging Technologies, Trends, and Possibilities in Designing Multicore SoC
Platforms.
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3-D ICs . . . Technology, Design, CAD, and Manufacturing Challenges.
3.
Entrepreneurship & Technology: Dreams, Realities & Opportunities.
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Selected
Technology
&
Media
Sponsors |
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If you have any questions or need more information, please contact:
SoC@SavantCompany.com
or
949-851-1714
Thank you!
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Copyright © 2003-2012 by Savant Company Inc. All
Worldwide Rights Reserved.
Wafer images courtesy of Intel Corporation, Micron Technologies & Altera Corporation.
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