Call for Sponsors & Speakers

The 10th International System-on-Chip (SoC)

Conference, Exhibit & Workshops

 October 24 & 25, 2012

Hilton Irvine, California

         
 
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The Theme for This Year’s Conference Is “SoC Platforms for Embedded Systems.”

9th International SoC Conference In Pictures. . .

 

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SoC

Conference

Technical

Scope

Multimillion-transistor System-on-Chip (SoC) devices, comprising several CPUs & DSPs, analog, optical, digital, and Micro-Electro-Mechanical Systems (MEMS), are integral parts of everyday communication, entertainment, medical, digital consumer, automotive, and military products.

Over the past 9 years, the International SoC Conference has established itself as the premier annual event for System-on-Chip and VLSI. The Conference provides an outstanding platform for sharing and disseminating groundbreaking research, revolutionary product announcements, and innovative technical tutorials, and it has established itself as the forum for debating emerging challenges in System-on-Chip, VLSI, and Nanotechnologies.

The 10th International SoC Conference, Exhibit & Workshops will be held at the Hilton Irvine (California) and will offer two days of technical presentations, panel discussions, tabletop exhibits, tutorials, and a variety of technical workshops.

 

 

 
 

For the International System-on-Chip (SoC) Conference, the premier event devoted to Chip Design and Development, the SoC Conference Organizing Committee is seeking submissions on all aspects of IC & IP designs including:

 
 
  • Semiconductor

  • Foundry Services

  • RF & Analog/Mixed-Signal

  • Novel CMOS Design Techniques

  • EDA Tools, Algorithms, and Tool Usage

  • Design Methodologies, Techniques, and Technologies for All Aspects of Electronic Circuits

  • Network-on-Chip (NoC) & System-Level Communication

  • FPGA Design, Tools, and Applications

  • Embedded Design and Platforms

  • Floor-Planning

  • Logic Synthesis and Circuit Optimization

  • Timing and Circuit Analysis and Circuit Optimization

  • Emerging Specialized Design Technologies

  • Manufacturing Test and Silicon Debug

  • Beyond Die-Integration and

  • Package/Hybrid/Board Design

  • Novel Software Architecture for Multicore SoCs

  • IC & IP Design

  • SiP and Innovative Packing Techniques

  • Circuit Simulation and Interconnect Analysis

  • Timing Analysis and Design for Manufacturability

  • Physical Design and Manufacturability

  • Power Analysis and Low-Power Design

  • Validation, Test Planning, Testing and Coverage

  • Formal Verification

  • Signal Integrity and Design Reliability

  • System-Level Design and Co-Design

  • High-Level Synthesis

  • Physical Synthesis Tools and Techniques

  • Low-Power SoC Platforms

  • Cost-Effective SoC-Based Platform Solutions

  • Designing Multicore SoC Platforms

  • Embedded Software, Tools and Design

 

In addition to conventional SoC-related topics, the SoC Conference invites proposals for topics for individual Tracks, Panels, Workshops and Tutorials.
 

SoC

Conference

Sponsorship

opportunities

 

The SoC Conference provides a series of unique sponsorship opportunities for participating companies interested in promoting their names, logos, and brands and their products and technologies to a very targeted and interested audience

To receive a complete listing of all available sponsorship opportunities, please contact SoC@SoCconference.com or call us at 949-851-1714. We will be more than happy to customize our sponsorship packages to meet your budget and your marketing objectives.

SoC Conference Platinum and Gold sponsors’ logos will be displayed on the SoC Conference main page as well as on the Savant Company Web page until two weeks after the Conference. Sponsors’ logos are always displayed on the SoC Conference public archives page. Our Platinum and Gold sponsorship packages include Tabletop Exhibit opportunities, several complimentary Conference passes, and a variety of promotional opportunities. For specific sponsorship details, please contact SoC@SoCconference.com   

 

 

SoC

Conference

Tabletop

Exhibit

 

The SoC Conference Tabletop Exhibit is an outstanding, inexpensive forum for your Sales, Marketing, and Applications Engineering teams, allowing them to meet face-to-face with design engineers attending the Conference or visiting the Tabletop Exhibit.

 

To reserve your Tabletop Exhibit space please contact SoC@SoCconference.com.  SoC Conference Tabletop Exhibit provides several free full conference passes as well as a series of outstanding promotional opportunities for the exhibiting companies. Please contact us for more information and to receive the Tabletop Exhibit application/contract.

 

 

SoC

Conference

Speaking

opportunities

 

Track and Session Presenters, Keynote Speakers, and Panel Members who can contribute their professional expertise have a wonderful opportunity to share their innovative SoC, ASIC, ASSP, FPGA, and Foundry-related technology or products at this event to a very focused and targeted audience.

Technical presentations are invited that address new and previously unpublished results on System-on-Chip topics and related areas such as CAD/EDA Tools, Analog, Mixed-Signal and RF Circuits and Systems, NoC, etc.
 

To explore speaking opportunities at the 9th International SoC Conference, for information on our Tabletop Exhibit, or to develop highly targeted Workshops, please contact the SoC Conference Organizing Committee at:

 

SoC@SavantCompany.com     or    SoC@SoCconference.com   or    (949) 851-1714

 

 

AUTHOR

INFORMATION

AND

FORMAT

 

Presentations at the International System-on-Chip (SoC) Conference are in the form of 30-minute talks with PowerPoint slides. Presentation slides will be published in the SoC Conference Proceedings. Participants are not required to submit written papers, but a select group will be invited to submit a paper for inclusion in the SoC Conference Proceedings.

Submissions must include a title, an extended abstract (two pages maximum), and the presenter's contact information (name, affiliation, job title, bio, address, phone, fax, and email). Please indicate whether you have submitted, intend to submit, or have already presented or published a similar or overlapping submission to another conference or journal. Also indicate if you would like the submission to be held confidential.

Submissions are evaluated by the SoC Conference Organizing Committee and the SoC Technical Advisory Board on the basis of the overall complexity of the technology or device, the degree of innovation, the incorporation of advanced technology, the potential market significance, and most importantly, the anticipated interest to the audience. Research and software proposals will be evaluated by similar criteria. If you are describing a product, you must indicate its status: its design, development, tape out, silicon, shipping, etc.

Please submit your extended abstract in plain ASCII or PDF to: SoC@SoCconference.com   or   SoC@SavantCompany.com  ASAP.  

Submissions containing figures may be submitted in .pdf, but plain ASCII text or MS Word is preferred.

 

 

Don't Miss Out!

 

Please submit your proposed Abstract & Bio ASAP

for SoC Conference Organizing Committee & Technical Advisory Board

Review and Consideration.

 

 

Questions

SoC@SoCconference.com    or   949-851-1714

 

Attendee

 demographics

 

Attendee demographics for past SoC Conferences (based on job responsibilities):

  • 76% SoC & ASIC Designers, Design Engineers, and Engineering Management

  • 11% Technical Marketing, Sales, or Business Development Management

  • 8% University Engineering Professors and Engineering Students

  • 3% Strategic Planning, Media, Analysts

  • 2% Other

 

 

 
     
 

November 2011

The 9th International System-on-Chip (SoC) Conference

Participants

 
     

 

Keynote Speakers

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Purdue University

Dr. Eugenio Culurciello,

Associate Professor, Electrical Engineering.

 

Xilinx

Dr. Steve Trimberger, Fellow,  Circuits & Architectures Group.

Microsemi

Paul Pickle, Senior Vice President, Integrated Circuit Group.

Johns Hopkins University

Dr. Ralph Etienne-Cummings,
Professor Department of Electrical and Computer Engineering.

 

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Platinum Sponsors

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Gold Sponsors

 

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Selected Participating Companies, Universities & Organizations

 

JRI Technology

 

 

 

 

 

SoC Conference Tracks & Panels

 

30-min Technical Presentation Opportunities In the Following Tracks:

 

1. Emerging Technologies, Trends, and Possibilities in Designing Multicore SoC Platforms.

2. Analog and Mixed-Signal Design Trends and Challenges for Low-Power Embedded SoC Platforms.

3. SOI vs. CMOS for Analog & Digital Circuits – Technology, Trends, Challenges, and Emerging Applications.

4. Green Chips: Technologies, Tools, and Methodologies in Designing Ultra Low-Power Multicore SoCs.

 

Panelist Opportunities (No Abstract or Presentation Is Required –Please Submit Full Title, Bio and Picture for TAB Review and Consideration) In the Following Panels:

 

1. Emerging Technologies, Trends, and Possibilities in Designing Multicore SoC Platforms.

2. 3-D ICs . . . Technology, Design, CAD, and Manufacturing Challenges.

3. Entrepreneurship & Technology: Dreams, Realities & Opportunities.


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Selected

 

Technology

 

&

 

Media

 

Sponsors

JRI Technology

 

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If you have any questions or need more information, please contact:
SoC@SavantCompany.com
or
949-851-1714
Thank you!
 

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Copyright © 2003-2012 by Savant Company Inc. All Worldwide Rights Reserved.

Wafer images courtesy of Intel Corporation, Micron Technologies & Altera Corporation.

 

 

 

 

 

 

 

 

 

 

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