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The 12th International System-on-Chip (SoC)

Conference, Exhibit & Workshops

 October 22 & 23, 2014

University of California, Irvine (UCI) - Calit2

11th International SoC Conference In Pictures. . .

         
 
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Annual IEEE ORANGE COUNTY SECTION

&

SOLID-STATE CIRCUITS SOCIETY

Student Design Contest

 

 

 

 

Directions & Parking for Calit2 Building at the University of California, Irvine (UCI)
 

Sponsored By:

   

 

Engineering & Computer Science Students. . .

 

IEEE Orange County Section cordially invites you to participate in its 2014 Student Design Contest (SDC)!  The Contest will be held on Wednesday, October 22, 2014, at the 12th International System-on-Chip (SoC) Conference Exhibit, UCI Calit2 Building. 

 

The SDC provides an outstanding forum in which graduate and undergraduate students’ efforts can be shared with an audience of academic and industrial technical experts.

 

 

SDC Project Proposal

 

The Student Design Contest is designed to encourage engineering and computer science undergraduates and graduates students to work on a new project and present their work at the 11th International System-on-Chip (SoC) Conference Exhibit to a group of judges from industry and academia.

 

Each project will be judged based on its overall complexity, originality, and completion of the work.

 

 

 

“Wild & Crazy” Design Projects Are Also Welcomed!

We Look Forward To Hearing From You.

Don’t Miss Out!

An Excellent Opportunity To Network & Promote Your Engineering Talent & Expertise!

 

Dates to Remember*

 

(1) IEEE-OC Student Design Contest Submissions (jointly sponsored by IEEE-OC Section and SSCS-OC chapter), the contest promotes excellence in the engineering- and computer science-related designs within an academic environment and provides a forum in which undergraduate/graduate engineering and computer science students’ ingenuity can be shared with an audience of academic/industrial technical experts. The participating students will present their designs through posters at the 11th International SoC Conference. Students must submit their project abstracts by Wednesday, October 1, 2014, to: SoC@SoCconference.com.
 

(2) Friday, October 17, 2014: Deadline for submission of Progress or Final Report (in MS Word or PowerPoint).

Submit to: SoC@SoCconference.com

 

(3) Wednesday, October 22, 2014: Projects will be reviewed and winners will be announced at the 11th International SoC Conference Exhibit reception starting at 5:00 PM, at the UCI Calit2.

 

Prizes*

(1) The first 40 students who submit their PROGRESS or FINAL report/papers will receive a Western Digital Passport Hard Drive! You must be at the event on Wed, Oct. 22, to receive your WD Hard Drive. No Exceptions!

 

(2)

  • First Prize:      $500.00

  • Second Prize:  $300.00

  • Third Prize:     $200.00

(3) All participating students (who have submitted their Final Report) will receive a FREE "2-Day Conference Package," valued at $699!

 

(4) Names and pictures of the winners will be displayed on the SoC Conference, IEEE OC Section websites,  and related media. 

 

 

Contest Rules*

 

(1) Final Report format must be in MS Word or PowerPoint. 

(2) Poster size: 24x36 (or slightly larger). 

(3) Poster presentation date: Wed, Oct 23.

(4) Students must be at the SoC Conference Exhibit Room for poster setup & to discuss their projects with the judges at 5:00 pm on Wed, Oct 22.

(5) Check the website for updates.

 

* SDC Program is subject to change.  Savant Company Inc. and the SoC Conference Organizing Committee reserve the right to revise or modify the above program at its sole discretion. Please visit the SoC Conference website for updates and changes.

 

Questions


Please send your questions to: SoC@SoCconference.com

 

 

Student Design Contest Judges

 

Russell Hunter, Senior Software Engineer.

Past IEEE Orange County Section Chairman.

 

Professor, Nader Bagherzadeh, UCI, EECS.

 

Western Digital Corporation

Bill Boyle, Director, Systems Architecture.

 

Dr. David Cheng, Tenured Full Professor,  EE Department, CSU Fullerton.

 

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Wafer images courtesy of Intel Corporation, Micron Technologies & Altera Corporation.

 

 

 

 

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